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FR4 TG170 HDI PCB Board

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FR4 TG170 HDI PCB Board

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Brand Name : Huashengxin

Model Number : 177846

Certification : UL , ISO9001

Place of Origin : China

MOQ : 1pcs

Payment Terms : T/T

Delivery Time : fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production

Packaging Details : vacuum

PCB Name : 6L 2+N+2 HDI Printed Circuit Board

Marterial : FR4 TG170

Surface finished : Immersion gold

Board Thickness : 2.0mm

Copper thickness : 1/1/1/1/1/1OZ

Min.PCB track/gap : 3/3mil

Solder mask : Green, two sides

Smallest Mechanical drilling hole : 0.2mm

Special requirement : HDI Buried vias and blind vias, two step stack up /0.25mm BGA

Applicationcommunications products : industrial control

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FR4 TG170 HDI PCB Board

HDI PCB Board HDI Blind Buried Vias Two Step Stack Up PCB Assembly Services Green PCB Board High Density Printed Circuit

6L 2+N+2 HDI Printed Circuit Board


HDI stands for High-Density Interconnector. It is a special type of PCB that has the capability of high-density interconnections. It means that HDI boards has more wires or conduction lines per unit area, utilizing the most out of the space and offering a compact PCB.

HDI PCB has tightly packed interconnections, it saves a lot of space and offers more component density and it has the capability of making a circuit compact.

HDI boards are particularly attractive to portable, mobile, and portable electronics due to their slim, dependable performance and tiny size. HDI technology is a critical component of many of advanced technologies. The miniaturization of electronic components including PCBs has enabled manufacturers to produce smaller, more cost-effective devices without sacrificing performance or reliability.

They are largely used in Consumer Electronics, communication, Automotive and Aerospace,Medical Devices, and industry control products and other industries.

Circuit board Layer count: 6L Circuit board laminate: FR4 TG170
Layer Copper thick: 1/1/1/1/1/1OZ Board thickness: 2.0MM
Smallest hole size: 0.20mm Smallest PCB track/gap: 3/3mil
Solder mask color: Green Silk screen color: White
PCB surface finished: Immersion Gold Board profile: Routing
PCB Board Application: industrial control
Requesting Special requirement: small line space and gap:3/3mil/HDI Buried vias and blind vias, two step stack up /impedance control/0.25mm BGA

FR4 TG170 HDI PCB BoardFR4 TG170 HDI PCB Board

FAQ:
Q1:Could you provide PCB Assembly services and components sourcing?
A: Yes, we could also provide components sourcing and PCB Assembly services as well as box build if request.

Q2:Which countries have you worked with?
A:USA, Canada, Italy, Germany, UK, Spain, France, Russia, Iran, Turkey, Czech Republic,Austria, Australia, Brazil, Japan, India etc.

Q3:Are my PCB files safe when I submit them to you for manufacturing?
A: We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written permission from your side, nor we'll share these files with any other 3rd parties. And we could sign NDA with client if necessary.

Q4:If we have no PCB file/Gerber file, only have the PCB sample,can you produce it for me?
A: Yes,we could help you to clone the PCB. Just send the sample PCB to us, we could clone the PCB design and work out it.

Q5:What is your standard lead time for PCB?
A: Sample/prototype(less than 3sqm):
1-2 Layers: 3 to 5working days (fastest 24hours for quick turn services)
4-8 Layers: 7~12 working days (fastest 48hours for quick turn services)
Mass production (less than 200sqm):
1-2 Layers:7 to 12 working days
4-8 Layers:10 to 15 working days


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