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Immersion Gold High Density Interconnect Pcb Board 6 Layer FR4 TG170

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Immersion Gold High Density Interconnect Pcb Board 6 Layer FR4 TG170

Brand Name : Huashengxin

Model Number : 131511

Certification : UL , ISO9001

Place of Origin : China

MOQ : 1pcs

Payment Terms : T/T

Delivery Time : fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production

Packaging Details : vacuum

PCB Name : High Density Interconnect Pcb

Marterial : FR4 TG170

Board Layer : 6L

Board Thickness : 0.8mm

Min.PCB track/gap : 4/3mil

Solder mask : Blue

Smallest Mechanical drilling hole : 0.15mm

Special request : min. via hole size 0.15mm/impedance control/half hole

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Immersion Gold High Density Interconnect Pcb Board 6 Layer FR4 TG170

6L 1+N+1 HDI Boards

What’s HDI PCB? High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring, which allow for a faster connection while reducing the size and bulk of a project. These boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads.


A HDI board can house the functionality of the previous boards used. MADPCB is an HDI PCB manufacturer and provider in Shenzhen, China supports HDI PCB prototype and mass production with less expensive price and quick-turn lead time. Customers from a variety of industries we serve have a common that have high expectations in quality, reliability and on-time delivery in HDI PCB production. Our quality is not afterthought, but built into each process from front-end to fabrication and shipping.

PCB Layer 6L PCB material FR4 TG170
Copper thickness 1/1/1/1/1/1OZ PCB thickness 0.80MM
Min. hole size 0.15mm Min.PCB track/gap: 4/3mil
PCB solder mask Blue PCB silkscreen White
PCB surface finished Immersion Gold PCB outline Routing
Application digital products
Special requirement: small line space and gap:4/3mil/HDI Buried vias and blind vias, one step stack up /min. via hole size 0.15mm/impedance control/half hole/0.25mm BGA/plating edge

Application of PCB Printed Circuit Board:

1, Telecom Communication
2, Consumer Electronics
3, Security monitor
4, Vehicle Electronices
5, Smart Home
6, Industrial controls
7, Military & Defense

Immersion Gold High Density Interconnect Pcb Board 6 Layer FR4 TG170

Immersion Gold High Density Interconnect Pcb Board 6 Layer FR4 TG170

Advantage Of PCB Printed Circuit Board

• Strict product liability, taking IPC-A-160 standard

• Engineering pretreatment before production

• Production process control (5Ms)

• 100% E-test, 100% visual inspection, including IQC, IPQC, FQC, OQC

• 100% AOI inspection, including X-ray, 3D microscope and ICT

• High-voltage test, impedance control test

• Micro section, soldering capacity, thermal stress test, shocking test


Product Tags:

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Immersion Gold High Density Interconnect Pcb Board 6 Layer FR4 TG170 Images

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